To provide a package for storing an electronic component which can be formed with a flat airtight space having a high hermeticity by joining a lid to the front surface thereof.

The package for storing an electronic component comprises an insulation substrate 1 formed with a mounting section 1a for mounting an electronic component 4 on the top face, interconnection conductors 5 formed on the top face of the insulation substrate 1, and a frame-like metallized layer 3 which is formed in the periphery of the top face of the insulation substrate 1 so as to surround the mounting section 1a. On the front surface of the metallized layer 3, a plurality of convex portions 3a are formed. The closer to the inner peripheral surface side of the top face of the insulation substrate 1 the convex portions 3a are located, the higher they become.