To provide a multiple patterning wiring board which enables the confirmation of electrical capacitance of capacitive elements formed in the wiring board without being divided into individual wiring boards, and from which wiring boards with superior electrical characteristics and a good productivity can be obtained.

A rectangular ceramic mother substrate 1 is made by stacking a plurality of ceramic layers. In top view, the ceramic mother substrate 1 has at the center an overall rectangular wiring board region 5 wherein a plurality of rectangular wiring boards 4 are arranged crosswise and lengthwise and has a dummy region 6 in the periphery. In each wiring substrate portion 4, wiring conductors 3 are formed both on the surface and inside. On the surface and inside of each corner region 6a in the dummy region 6 defined by extended lines of boundary lines between the rectangular wiring board region 5 and the dummy region 6, dummy wiring conductors 7 are formed in the same pattern as that of the wiring conductors 3.