Title:
【考案の名称】組立てリーマ
Document Type and Number:
Japanese Patent JPH0611708
Kind Code:
Y2
Inventors:
Hideo Ito
Application Number:
JP17934587U
Publication Date:
March 30, 1994
Filing Date:
November 25, 1987
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO.,LTD.
International Classes:
B23D77/00; (IPC1-7): B23D77/00
Attorney, Agent or Firm:
Masatake Shiga (1 person outside)
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