Title:
JIG FOR ASSEMBLING ELECTRONIC PART INTO THREE-DIMENSIONAL PRINTED BOARD
Document Type and Number:
Japanese Patent JP3048297
Kind Code:
B2
Abstract:
PURPOSE: To make it possible to simultaneously assemble a plurality of three- dimensional printed boards, and perform subsequent soldering of parts at a time, by moving each of a pair of part holders in and outside the space between a front side printed board and a back side printed board.
CONSTITUTION: The front side leads 9a of all electronic parts 7 are inserted into the proper through holes in a front side printed board 6a. A back side printed board 6b is positioned using a positioning means 10, and placed on the electronic parts 7. Thus the back side leads 9 of the electronic parts 7 are inserted into the proper through holes in the back side printed board 6b, and a three-dimensional printed board is temporarily assembled. The temporarily assembled three-dimensional printed board is set on a soldering apparatus 4. This makes it possible to solder leads on the bottom side at a time by dip soldering in a subsequent soldering process, and thus enables leads soldering on both sides to be made simultaneously.
Inventors:
Takeshi Komiyama
Application Number:
JP22341793A
Publication Date:
June 05, 2000
Filing Date:
September 08, 1993
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K1/14; H05K3/34; H05K3/36; (IPC1-7): H05K3/36; H05K1/14; H05K3/34
Domestic Patent References:
| JP4345083A | ||||
| JP5766695A | ||||
| JP6177502A |
Attorney, Agent or Firm:
Toyoaki Fukui