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Patent Searching and Data


Title:
RADIATION-SENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0733855
Kind Code:
A
Abstract:

PURPOSE: To obtain the subject composition useful for negative type resist, having excellent sensitivity, residual film ratio and adhesivity to a substrate, comprising a specific copolymer, a phenolic compound, a melamine, a triazine and an onium salt.

CONSTITUTION: (A) A copolymer of an unsaturated carboxylic acid, an epoxy group-containing radically polymerizable compound and another radically polymerizable compound, (B) a phenolic compound, (C) a melamine of formula I [R1 to R6 are H or CH2OR (R is H or 1-6C alkyl)] and (D) a trihalomethyltriazine of formula II {X is halogen; A is CX3 or group of formula III [B, D and E are H, 1-10C alkyl, thioalkyl, (thio)aryl, alkoxy, aryloxy, halogen, cyano, nitro, 1-10C alkyl bonded tertiary amino, carboxyl, etc.; (m) is 1-5] or an onium salt of formula IV (A)nZ+Y- (Z is sulfur or iodine; Y is BF4, PF6, SbF6, AsF6, etc.; (n) is 2-3).


Inventors:
SHIMOKAWA TSUTOMU
SANO KIMIYASU
ENDO MASAYUKI
BESSHO NOBUO
Application Number:
JP20105793A
Publication Date:
February 03, 1995
Filing Date:
July 21, 1993
Export Citation:
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Assignee:
JAPAN SYNTHETIC RUBBER CO LTD
International Classes:
C08F220/32; C08F20/32; C08G59/00; C08G59/18; C08G59/32; C08L33/00; C08L33/04; G03F7/004; G03F7/038; H01L21/027; (IPC1-7): C08G59/32; C08G59/18; C08L33/00; G03F7/004; G03F7/038; H01L21/027