Title:
【発明の名称】セラミック接合用コンパウンド
Document Type and Number:
Japanese Patent JP3017372
Kind Code:
B2
Inventors:
Masaru Shinbo
Application Number:
JP6590993A
Publication Date:
March 06, 2000
Filing Date:
March 03, 1993
Export Citation:
Assignee:
Toshiba Ceramics Co., Ltd.
International Classes:
C04B37/00; (IPC1-7): C04B37/00
Domestic Patent References:
| JP3159968A | ||||
| JP63170279A | ||||
| JP62227981A | ||||
| JP54134744A | ||||
| JP5767083A |
Attorney, Agent or Firm:
Rie Ishimura (2 outside)