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Patent Searching and Data


Title:
PRINTED WIRING BOARD AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH0575228
Kind Code:
A
Abstract:

PURPOSE: To provide a printed wiring board which enables connection of rigid wiring boards without using a connector and a manufacture method thereof.

CONSTITUTION: Printed wiring board wherein rigid wiring boards 1A, 1B which are provided with a circuit pattern such as a connection through-hole 11 up and down a flexible wiring board 12 provided with a circuit pattern such as a connection through-hole 11 are laminated so that the circuit patterns provided to each of wiring boards 1A, 1B, 12 are mutually connected, and the rigid wiring boards (1A, 1B) up and down the flexible wiring boards 12 which requires bending process are cut out selectively.


Inventors:
YAMAMOTO KENJI
Application Number:
JP23430591A
Publication Date:
March 26, 1993
Filing Date:
September 13, 1991
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H05K1/14; H05K3/36; H05K3/00; (IPC1-7): H05K1/14; H05K3/36
Attorney, Agent or Firm:
Teiichi