Title:
FILM FORMING METHOD AND DEVICE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3093185
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To form a film superior in a burying property in which a liquid permeates sufficiently into the interior of holes or grooves fined on a processed body in a film forming method and film forming device of a semiconductor device.
SOLUTION: When a film is formed on a surface of a substrate W, a drive motor 16 is first driven to rotate a turn table 14 supporting the substrate W. A liquid containing an organic metal is coated from a frontal end of a nozzle 24 on the substrate W, and also ultrasonic waves are generated by an ultrasonic waves generator 30 to vibrate the turn table 14 at a predetermined frequency. Then, the vibrations of the turn table 14 transmit to the substrate W, and the liquid containing the organic metal permeates sufficiently into the interior of fine patterns on a surface of the substrate W due to the vibrations of the substrate W, so that the liquid is filled up over all the interior.
Inventors:
Yuuichi Wada
Hiroyuki Yukida
Hisashi Aida
Naomi Yoshida
Hiroyuki Yukida
Hisashi Aida
Naomi Yoshida
Application Number:
JP30867498A
Publication Date:
October 03, 2000
Filing Date:
October 29, 1998
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/288; C23C2/32; C23C4/12; C23C18/02; H01L21/3205; H01L23/52; (IPC1-7): H01L21/288; C23C18/02; H01L21/3205
Domestic Patent References:
| JP5160018A | ||||
| JP3157658A | ||||
| JP453132A |
Attorney, Agent or Firm:
Yoshiki Hasegawa (2 outside)