Title:
MANUFACTURE OF MULTILAYER COPPER-CLAD LAMINATED BOARD
Document Type and Number:
Japanese Patent JP2602423
Kind Code:
B2
Abstract:
PURPOSE: To provide a method for efficiently laminating a multilayer copper-clad laminated board and a method for heating, pressurizing and molding in which the positional deviation can be prevented.
CONSTITUTION: A multilayer copper-clad laminated board is manufactured by the steps of providing a plurality of guide holes 4 for interlayer aligning an inner layer printed wiring board 2 having a conductor circuit with a prepreg 1 of adhesive, inserting laminating pins 5 to align it, then heating the pins 5 to 110 to 180°C to cure the prepreg 1 in ring state of about 10mm of the periphery of the pins 5, adhering the prepreg 1 to the board 2, then removing the pins after adhering, laminating the outer layer copper foil 3, heating, pressurizing and molding it.
Inventors:
Fukushima
Application Number:
JP984095A
Publication Date:
April 23, 1997
Filing Date:
January 25, 1995
Export Citation:
Assignee:
Toyama NEC Corporation
International Classes:
B32B15/08; H05K3/46; (IPC1-7): H05K3/46; B32B15/08
Domestic Patent References:
| JP5969997A | ||||
| JP63137929A | ||||
| JP415994A | ||||
| JP5200739A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)