Title:
ADHESIVE COMPOSITION FOR COVER-LAY FILM
Document Type and Number:
Japanese Patent JPH0539471
Kind Code:
A
Abstract:
PURPOSE: To provide an adhesive composition for cover-lay film having high peeling strength, heat-resistance, insulation, flexibility, etc., and free from the problem of electrical corrosion.
CONSTITUTION: The objective adhesive composition for cover-lay film contains a main agent consisting of a carbonate polyol having a diamine added to a molecular terminal through a diisocyanate group and a curing agent consisting of an epoxy compound. It can be cured by reacting the diamine on the terminal of the carbonate polyol with the epoxy group of the epoxy compound.
Inventors:
HAYASHI TAKAHIRO
NAKAMA KOKI
UENO KEIJI
KIMURA TOSHIHIDE
NAKAMA KOKI
UENO KEIJI
KIMURA TOSHIHIDE
Application Number:
JP22221091A
Publication Date:
February 19, 1993
Filing Date:
August 07, 1991
Export Citation:
Assignee:
TOKAI RUBBER IND LTD
SUMITOMO ELECTRIC INDUSTRIES
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
C08G59/50; C08G59/00; C08L63/00; C09J163/00; H05K3/28; H05K3/38; (IPC1-7): C08G59/50; C08L63/00; C09J163/00
Attorney, Agent or Firm:
Michio Nakajima (2 outside)