Title:
【発明の名称】電子部品用パッケージ、その蓋体用の蓋材およびその蓋材の製造方法
Document Type and Number:
Japanese Patent JP3078544
Kind Code:
B2
Abstract:
A lid material (1) is provided which comprises: a core layer (2) composed of an Fe-Ni alloy or an Fe-Ni-Co alloy; a nickel-based (Ni-based) metal layer (3) press- and diffusion-bonded onto the core layer (2) and composed of a Ni-based metal, such as pure Ni, mainly comprising Ni; and a brazing material layer (5) press-bonded onto the Ni-based metal layer (3). The Ni-based metal layer (3) has a maximum-to-minimum thickness ratio T1/T2 of 1.4 to 15. The lid material (1) is produced by press-bonding a Ni-based metal foil onto a core sheet for formation of the Ni-based metal layer on the core layer, then diffusion-annealing the Ni-based metal layer and the core layer, and press-bonding a brazing material foil onto the Ni-based metal layer with a reduction ratio of 30 to 65%.
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Inventors:
Kenichi Funamoto
Hidetoshi Noda
Masaaki Ishio
Hidetoshi Noda
Masaaki Ishio
Application Number:
JP21831099A
Publication Date:
August 21, 2000
Filing Date:
August 02, 1999
Export Citation:
Assignee:
Sumitomo Special Metal Co., Ltd.
International Classes:
B23K20/00; B32B15/01; H01L21/48; H01L23/02; H01L23/06; H05K10/00; (IPC1-7): H01L23/02; B23K20/00; B32B15/01
Domestic Patent References:
| JP653341A | ||||
| JP9199622A | ||||
| JP6351661A |
Attorney, Agent or Firm:
本田 ▲龍▼雄