Title:
MANUFACTURE OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2550899
Kind Code:
B2
Abstract:
PURPOSE: To provide a highly reliable printed wiring board having no faulty soldering after mounting of a part by a method wherein the generation of saggings by heat when a photosolder resist is exposed and the prescribed front and back side continuity holes are completely blocked up.
CONSTITUTION: A photo-cured part 6 is formed by coating photosolder resist 4 on one surface of an insulating substrate 1 with a front-back continuity hole 2, the internal photosolder resist 4 is exposed by passing light through the prescribed front-back continuity hole 2 only from the other surface, and a photo- cured part 6 is formed. Then, the non-exposed part of the photosolder resist 4 is developed and removed by exposing from the coated surface. Pertaining to the other surface, photosolder resist 4 is applied, exposed and developed using the ordinary method, the photosolder resist 4 on both sides of the insulating film 1 is completely hardened, and a printed wiring board, having the completely blocked front-back continuity hole 2, is obtained.
More Like This:
Inventors:
TSUNODA TAKANORI
Application Number:
JP31141093A
Publication Date:
November 06, 1996
Filing Date:
December 13, 1993
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H05K3/28; (IPC1-7): H05K3/28
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)