PURPOSE: To prevent a drop in the reliability of a connection and a drop in a production yield by a method wherein a thermocompression-bonding jig whose tip shape is in a recessed shape is used and an inner-lead bonding operation is executed repeatedly.

CONSTITUTION: An inner-lead bonding operation is executed to bumps 2 on two opposite sides out of four sides on an IC and to inner leads 3. Then, a thermocompression-bonding jig 42 or a bonding stage part which fixes a film carrier tape including the IC and the inner leads 3 s turned by 90°; after that, the inner-lead bonding operation is executed to bumps 2 on two remaining sides on the IC and to inner leads 3. The thermocompression-bonding jig 42 comes into contact with the surface of the inner leads 3 during the inner-lead bonding operation. Even when the bumps 2 and the inner leads 3 are deformed in the transverse direction due to the heat and the load of the thermocompression-bonding jig 42, the deformation in the transverse direction of the bumps 2 and the inner leads 3 is controlled so as to be a minimum because the tip shape of the thermocompression-bonding jig 42 is of recessed structure. Thereby, it is possible to prevent a drop in the reliability of a connection and in a production yield.