【発明の名称】無電解メッキによりプリント回路を製造するための積層体、該積層体の製造方法および該積層体を用いる無電解メッキしたプリント回路の製造方法

Title:

Document Type and Number:

Japanese Patent JP2523740

Kind Code:

B2

Abstract:

The invention is directed to a laminate for the preparation of printed circuits by electroless plating of conductive metal thereon which comprises a. an electrically insulative substrate bearing b. an adherent layer of crosslinked polymeric adhesive, which is insoluble in photodielectric developing solutions, having partially embedded therein finely divided particles of adsorbent which protrude from the adhesive surface away from the substrate, the protrusive surfaces of which are adsorptive with respect to electroless plating catalysts or reductive precursors thereof, and c. a solid layer of photodielectric adherently overlying the layer of adhesive and adsorbent particles. a

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Inventors:

EIBURAHAMU BAANAADO KOOEN
ROKISHII NI FUAN
JON ANSONII KUIN

Application Number:

JP33679587A

Publication Date:

August 14, 1996

Filing Date:

December 28, 1987

Export Citation:

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Assignee:

II AI DEYUHON DE NIMOASU ANDO CO

International Classes:

C23C18/16; C23C18/18; C23C18/20; C23C18/28; C23C18/31; C23C18/34; C23C18/40; C23C18/44; G03F7/004; H05K1/18; H05K3/18; H05K3/38; H05K3/00; (IPC1-7): H05K3/18; C23C18/16

Domestic Patent References:

JP4978173A

Attorney, Agent or Firm:

Takehiko Suzue (2 outside)

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