PURPOSE: To eliminate a crack by fixing a semiconductor chip to a thin metal plate through a layer for die bonding such as Ag glass, and fixing this metal plate to a glass substrate through an Ag paste and the like, to form a fluorescent character display tube having a chipin-glass structure.
CONSTITUTION: An Ag glass paste for bonding or a frit glass paste is applied to the upper surface of a metal plate 14, on which a semiconductor chip 6 is to be mounted, or on the back surface of the chip 6, by stamping method and the like. The chip 6 is put on the metal plate 14 while positioned accurately, and the Ag paste and the like is applied to cut pieces 14a provided on the four corners of the metal plate 14. For the Ag paste or the frit glass paste, a material having a coefficient of thermal expansion closer to that of a base material consisting of metal plate or glass plate, is selected. The glass substrate 1 on which the chip 6 is mounted, is put into a baking furnace of oxidation atmosphere of peak temperature of 400-500°C, and is heated and hardened for bonding.
KANI YASUYUKI
ENDO NOBORU
MORI JUN
MATSUMOTO SHUNICHI
FUJII TETSUO
TAKEI HIROSHI
NUMAZAKI KOJI
KYUSHU NORITAKE KK
NIPPON DENSO CO