Title:
【発明の名称】半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP3005554
Kind Code:
B1
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents wires from coming into contact with each other, is enhanced in storage capacity, and can be manufactured at a low cost and a manufacturing method thereof. SOLUTION: A semiconductor device 1 is manufactured through a manner where memory chips 3 which are of the same type, formed in one piece, and mounted on a lead frame 4 without being separated by cutoff, the equivalent pads 5 out of pads 5 formed on the surfaces of the memory chips 3 are wired to form common pads 7, and the common pads 7 are wire-bonded to the lead 8 of the lead frame 4.
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Inventors:
Naoto Kimura
Application Number:
JP33004198A
Publication Date:
January 31, 2000
Filing Date:
November 19, 1998
Export Citation:
Assignee:
Kyushu NEC Corporation
International Classes:
H01L25/18; H01L21/60; H01L23/538; H01L25/04; (IPC1-7): H01L25/04; H01L23/538; H01L25/18
Domestic Patent References:
| JP9152449A | ||||
| JP9252020A |
Attorney, Agent or Firm:
Nobuo Takahashi (3 outside)