Title:
METHOD OF WIRE BONDING FOR COATED WIRE
Document Type and Number:
Japanese Patent JP3074517
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method of wire bonding, which prevents a coated wire from bending or leaving a second clamp and ensures he continuity of a bonding operation by shaking the second clamp to release the wire when a capillary and a first clamp are raised to the level at which a ball 1C is formed.
SOLUTION: After a predetermined part of a coated wire 1 is stripped, a second clamp 2 is closed and a first clamp 3 is opened. A capillary 4 and the first clamp 3 descend and the coated wire is fed by a tail length L3 from the tip of the capillary. The first clamp 3 is closed and the second clamp 2 is opened. The capillary 4 and the first clamp 3 are raised to the level, at which a ball 1C is formed. When the capillary and the first clamp are raised as above, the second clamp is shaken to release the wire.
Inventors:
Osamu Nakamura
Kazumasa Sasakura
Kazumasa Sasakura
Application Number:
JP34455195A
Publication Date:
August 07, 2000
Filing Date:
December 05, 1995
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
B23K20/00; H01L21/60; H01L23/49; (IPC1-7): H01L21/60
Domestic Patent References:
| JP319353A |
Attorney, Agent or Firm:
Yoshinori Tanabe