Title:
WIRE BONDING METHOD FOR COVERED WIRE
Document Type and Number:
Japanese Patent JP3074518
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent the bending of a covered wire and the coming off of the covered wire from the second clamper and to guarantee the continuity of bonding.
SOLUTION: In the process in which a capillary 4 and the first clamper 3 are brought up to the level of ball formation, after the first clamper 3 has been closed and the second clamper 2 has been opened, the capillary 4 and the first clamper 3 are brought down, a covered wire 1 is brought down, the sticking to the second clamper 2 is removed, and the capillary 4 and the first clamper 3 are brought up to the ball formation level.
Inventors:
Osamu Nakamura
Kazumasa Sasakura
Kazumasa Sasakura
Application Number:
JP34455295A
Publication Date:
August 07, 2000
Filing Date:
December 05, 1995
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H01L21/60; B23K20/00; H01L23/49; (IPC1-7): H01L21/60
Domestic Patent References:
| JP319353A |
Attorney, Agent or Firm:
Yoshinori Tanabe