【発明の名称】半導体製造装置

Title:

【発明の名称】半導体製造装置

Document Type and Number:

Japanese Patent JP2503680

Kind Code:

B2

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Inventors:

WASHITANI AKIHIRO
TSUTAHARA KOICHIRO
UMADONO SHINJI

Application Number:

JP21965089A

Publication Date:

June 05, 1996

Filing Date:

August 24, 1989

Export Citation:

Assignee:

MITSUBISHI ELECTRIC CORP

International Classes:

H01L21/205; H01L21/31; (IPC1-7): H01L21/205; H01L21/31

Domestic Patent References:

Attorney, Agent or Firm:

Kaneo Miyata (3 outside)

Previous Patent: JPH02503679

Next Patent: JPH02503681