Title:
RESIN SEALED SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0621329
Kind Code:
A
Abstract:
PURPOSE: To provide a highly integrated resin sealed semiconductor device having many built-in semiconductor chips.
CONSTITUTION: Bumps 4 are used to connect a semiconductor chip 2 to both sides of films 3, on which wiring is applied, and the bumps 4 are also used to connect leads 5 to both sides of films 3, on which wiring is applied. This allows one resin sealed semiconductor device to contain many semiconductor chips.
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Inventors:
KURIHARA KENICHI
Application Number:
JP17633992A
Publication Date:
January 28, 1994
Filing Date:
July 03, 1992
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/60; H01L25/065; H01L25/07; H01L25/18; (IPC1-7): H01L25/065; H01L25/07; H01L25/18; H01L21/60
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
Next Patent: SEMICONDUCTOR POWER MODULE