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Title:
METHOD AND DEVICE FOR MACHINING
Document Type and Number:
Japanese Patent JPH0751981
Kind Code:
A
Abstract:

PURPOSE: To excellently suppress scattering of chips by a method wherein cut ting liquid is caused to flow down from a feed means to form a cylindrical film of cutting liquid with which a cutting tool is surrounded.

CONSTITUTION: Since a cylindrical film 11' with which a cutting tool 5 is surrounded is formed of cutting liquid 11 by means of a feed means 12, even when a work 6 and the cutting tool 5 are relatively moved in an arbitrary direction along with a cutting work effected by using the cutting tool 5, the cutting liquid 11 is fed reliably all over the cutting part of the cutting tool 5 and the part to be machined of the work 6. Thereby, the cuttting tool 5 and the part to be machined of the work 6 are cooled with high efficiency. Further, since the periphery of the cutting tool 5 is covered with the cylindrical film 11' of the cutting liquid 11, even when chips generated during machining are intended to fly to a periphery, excellent suppression of flying of the chips is caused by the film 11 of the cutting liquid 11.


Inventors:
OKADA ROKURO
Application Number:
JP22222093A
Publication Date:
February 28, 1995
Filing Date:
August 13, 1993
Export Citation:
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Assignee:
TAIHO KOGYO CO LTD
International Classes:
B23Q11/00; B23Q11/10; (IPC1-7): B23Q11/10; B23Q11/00
Attorney, Agent or Firm:
Shinichiro Kanzaki