Title:
【考案の名称】電子部品搬送用テープの成形装置
Document Type and Number:
Japanese Patent JPH0619442
Kind Code:
Y2
Inventors:
Tomio Yamada
Application Number:
JP9884989U
Publication Date:
May 25, 1994
Filing Date:
August 24, 1989
Export Citation:
Assignee:
CKD Corporation
International Classes:
B65D85/86; B29C51/08; B29C51/20; B65B15/04; B65B47/02; B65B47/08; B65D85/38; B29L7/00; (IPC1-7): B65B47/08; B29C51/20
Domestic Patent References:
| JP61152531A |
Attorney, Agent or Firm:
Kyozo Yuasa (4 outside)
Next Patent: SURFACE MODIFICATION OF POLYMER MATERIAL