Title:
THIN-PLATE-MATERIAL DIPPING APPARATUS
Document Type and Number:
Japanese Patent JP3069243
Kind Code:
B2
Abstract:
PURPOSE: To prevent continuance of the tightly contact state between thin plate materials when a thin-plate-material containing part is lifted from a liquid tank.
CONSTITUTION: In an underwater loader 1, a cassette C, which contains many wafers W at the multiple upper and lower stages and has an opening 13 for outputting and receiving the wafers, is dipped in liquid. The loader 1 has a water tank 11, a cassette lifting device 12 and a pure-water supplying head 35. Pure water is stored in the inside the water tank 11, and the cassette C is dipped in the liquid. The cassette lifting device 12 lifts and lowers the cassette C in the water tank 11. The pure-water supplying head 35 has a pair of spray nozzles 36, which are horizontally arranged at an interval, and supplies the pure water in the direction of the opening of the cassette C at a position upper than the liquid surface of the water tank 11.
Inventors:
Kaoru Niihara
Yasuhiro Kurata
Masami Sawamura
Yasuhiro Kurata
Masami Sawamura
Application Number:
JP14202894A
Publication Date:
July 24, 2000
Filing Date:
June 23, 1994
Export Citation:
Assignee:
Dainippon Screen Mfg. Co., Ltd.
International Classes:
B65G49/04; H01L21/304; (IPC1-7): H01L21/304; H01L21/304
Domestic Patent References:
| JP55128834A | ||||
| JP4215878A | ||||
| JP5783036A | ||||
| JP7297155A |