PURPOSE: To prevent generation of an unpolished part for a polishing material of a member for an electronic part comprising tungsten or the like by forming it to be a polar body having a larger diameter and height than sizes of a recess formed in a subject work.

CONSTITUTION: A polishing material 12 for polishing a member 20 having a polar part 22 through a circular groove part 23 in a polar part 21 as illustrated, for example, is formed of the same material as the member 20 to be polar. A diameter D1 and a height H of it are set to be larger than the sizes of the groove part 23. For example, when a width W of the groove part 23 of the member 20 is 1mm, the diameter D1 and the height H of the polishing member 12 are set to exceed 1.0mm and not more than 3.0mm, This polishing material 12 is formed by pressing and sintering by powder metallurgy, and chamfered parts R are formed.