Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0718180
Kind Code:
A
Abstract:
PURPOSE: To obtain a material, having a high strength and rigidity under actual use conditions and excellent in impact resistance and appearance properties of molding surfaces.
CONSTITUTION: This polyamide resin composition is composed of 100 pts.wt. blended polyamide composed of (A) 40-95wt.% semiaromatic polyamide constructed from (a) 70-95wt.% hexamethylene adipamide unit obtained from adipic acid and hexamethylendiamine and (b) 5-30wt.% hexamethylene isophthalamide unit obtained from isophthalic acid and hexamethylendiamine and (B) 60-5wt.% aliphatic polyamide and (C) 10-250 pts.wt. inorganic filler.
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Inventors:
EBARA KENJI
Application Number:
JP16136993A
Publication Date:
January 20, 1995
Filing Date:
June 30, 1993
Export Citation:
Assignee:
ASAHI CHEMICAL IND
International Classes:
C08K3/00; C08L77/00; C08L77/06; (IPC1-7): C08L77/06; C08K3/00
Attorney, Agent or Firm:
Hidetake Komatsu (2 outside)
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