Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND PASTE PATTERN FORMING METHOD BY USING SAME
Document Type and Number:
Japanese Patent JP3413055
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of being easily stripped off in an aqueous solution and forming an overhung resist pattern and the paste pattern forming method by using this composition superior in reproduction performance and strippability by incorporating a water-soluble polymer and a diazo compound and a polymer emulsion.
SOLUTION: The paste pattern is formed by forming on the substrate the negative photosensitive resin composition layer for a liftoff system, comprising the water-soluble polymer and the diazo compound and the polymer emulsion and selectively removing imagewise exposed parts from the resin composition layer by the lithographic method, and filling the removed parts with a paste composition, and removing the remaining photosensitive resin layer.
Inventors:
Sadao Uemura
Yoshiro Abe
Shigeyuki Okumura
Hideki Marunaka
Hiroyuki Obiya
Yoshiro Abe
Shigeyuki Okumura
Hideki Marunaka
Hiroyuki Obiya
Application Number:
JP8730897A
Publication Date:
June 03, 2003
Filing Date:
March 24, 1997
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
Tokyo Ohka Kogyo Co., Ltd.
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/004; G03F7/26; G03F7/40; G03F7/42; H05K3/02; (IPC1-7): G03F7/26; G03F7/004; G03F7/40; G03F7/42; H05K3/02
Domestic Patent References:
| JP6010245A | ||||
| JP59216137A | ||||
| JP5721890A | ||||
| JP5721891A | ||||
| JP5721892A | ||||
| JP52137666A | ||||
| JP8222840A | ||||
| JP745931A | ||||
| JP511442A | ||||
| JP567433A |
Attorney, Agent or Firm:
Heihachi Hattori
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