Title:
光起電モジュール内においてシリコンウエハを装着するための新しい導体
Document Type and Number:
Japanese Patent JP2014509444
Kind Code:
A
Abstract:
The invention relates to an electrical conductor (2) having a longitudinal axis (A) parallel to the rolling direction of a conductor wire, comprising copper material and an attachment surface (7) configured for attaching to a receiving surface of a silicon wafer (3) to establish an electrical connection. The copper material has a purity of at least 99.5% wherein the grains have a cubic texture comprising a set of cubic axes directed within an up to 20 degree angular range to the longitudinal axis (A), and whereby at least 65% of the grains have said cubic texture. The invention also relates to a process for manufacturing conductor (2) and photo voltaic modules comprising said conductor (2), and silicon wafers.
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Inventors:
Hammer, tag
Hutchinson, Bevis
Lude, Lena
Hutchinson, Bevis
Lude, Lena
Application Number:
JP2013541214A
Publication Date:
April 17, 2014
Filing Date:
November 30, 2010
Export Citation:
Assignee:
Luvata Espoo Oy
International Classes:
H01L31/05; B23K1/00; B23K1/19; B23K1/20; C22F1/08; H01B1/02; H01B5/02; H01B13/00; B23K101/36; B23K103/12; C22F1/00
Domestic Patent References:
| JP2007107038A | 2007-04-26 | |||
| JP2008182171A | 2008-08-07 | |||
| JP2009019239A | 2009-01-29 | |||
| JP2005068484A | 2005-03-17 | |||
| JP2008248274A | 2008-10-16 | |||
| JP2012177197A | 2012-09-13 |
Attorney, Agent or Firm:
Patent business corporation Kita Aoyama International