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Title:
NON-CONTACT IC LABEL
Document Type and Number:
Japanese Patent JP2011165127
Kind Code:
A
Abstract:

To provide a non-contact IC label configured to disable a communication function of a non-contact IC medium when the label is removed from an object by use of heat.

The non-contact IC medium includes at least an IC chip storing predetermined identification information and a compact antenna for allowing communication between the IC chip and an information reader.The non-contact IC medium is layered on a label base material provided with at least an adhesive layer for pasting the non-contact IC label to the object on one face of the base material, and includes a solvent-reactive electroconductive layer that exhibits electroconductivity by action of the solvent such that the solvent-reactive electroconductive layer covers at least a part of a portion where the non-contact IC medium is layered.


Inventors:
FURUICHI KOZUE
Application Number:
JP2010030122A
Publication Date:
August 25, 2011
Filing Date:
February 15, 2010
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
G06K19/10; G06K19/07; G06K19/077; G09F3/00
Domestic Patent References:
JP2009134528A2009-06-18
JP2008186127A2008-08-14
JP2009169899A2009-07-30



 
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