Title:
NON-PERIPHERALS PROCESSING CONTROL MODULE HAVING IMPROVED HEAT DISSIPATING PROPERTIES
Document Type and Number:
Japanese Patent JP2010157256
Kind Code:
A
Abstract:
To improve heat dissipating properties of a processing control unit.
An encasement for a computer processing control unit comprises: a main support chassis having a plurality of wall supports and a plurality of junction centers containing means for supporting a computer component therein; a back surface that provides support for connecting a peripheral and other computing components; and a means for cooling the encasement.
COPYRIGHT: (C)2010,JPO&INPIT
Inventors:
SULLIVAN JASON
Application Number:
JP2010030182A
Publication Date:
July 15, 2010
Filing Date:
February 15, 2010
Export Citation:
Assignee:
SULLIVAN JASON
International Classes:
G06F1/20; G06F1/16; H05K7/00; H05K7/20; G06C
Domestic Patent References:
| JPS649686A | 1989-01-12 | |||
| JPS55151398A | 1980-11-25 | |||
| JPH05145208A | 1993-06-11 | |||
| JPS6164197A | 1986-04-02 | |||
| JPH10270879A | 1998-10-09 |
Attorney, Agent or Firm:
Sadao Kumakura
Fumiaki Otsuka
Disciple Maru Ken
Ino Sato
Fumiaki Otsuka
Disciple Maru Ken
Ino Sato
Previous Patent: INFORMATION PROCESSING DEVICE AND REMOVABLE UNIT
Next Patent: GLOBALLY-SPARED DISTRIBUTED STORAGE SYSTEM
Next Patent: GLOBALLY-SPARED DISTRIBUTED STORAGE SYSTEM