To obtain noncontact IC built-in paper in which the built-in part of a noncontact type IC inlet is smoothed, which has excellent printing/copying suitability including stacking properties, transportability, etc. and is printed/copied at the built-in part, and to provide a method for producing the same.
In the noncontact IC built-in paper 2 in which a noncontact type IC inlet 1 equipped with an IC chip 20 and an antenna 10 is built in a printed/copied medium 40 on an organic substrate sheet 30, the printed/copied medium 40 has a three layer structure, the intermediate layer 41 is a cardboard of bulky uncoated paper, an opening part 44 in response to the planar shape of the IC chip is engraved through the cardboard, the IC inlet 1 is arranged so that the IC chip 20 is inserted from the opening part into the intermediate layer, inside and outside surface layers 42 and 43 are made of thin paper such as good quality paper, an adhesive layer 46 of an adhesive is previously formed on one side of the thin paper. The surfaces of the adhesive layers 46 are bonded to the inside and outside surfaces of the cardboard.
AKIMOTO KAZUMI
FUKUMORI SHIGERU
