Title:
NOZZLE FOR SUCKING ELECTRONIC PART, AND MANUFACTURE OF NOZZLE FOR SUCKING ELECTRONIC PART
Document Type and Number:
Japanese Patent JP3853095
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a device applicable to multiple sorts of electronic parts, and producible in an extremely short time.
SOLUTION: This suction nozzle is installed on a suction head for vacuum suction through a suction hole 11c to suck an electronic part by vacuum at a lower end part. In this case, a main body part 11 having a suction groove 11e provided to be continuous with the suction hole 11c and a separate nozzle 12 provided with a suction hole to be applied to an electronic part to suck it are preliminarily manufactured, the separate nozzles 12 are combined to match the electronic part to be sucked to communicate the suction groove 11e in the main body part 11 with the suction holes as they are engaged with a mounting groove 11d, they are jointed by adhesive agent 14, and an open part of the suction groove lie where the separate nozzle 12 is not mounted is sealed by a reflection plate 13. A nozzle for sucking an electronic part applicable to a specific sort among multiple sorts of electronic parts can thus be manufactured in an extremely short time.
Inventors:
Yukawa Asahiro
Application Number:
JP32782698A
Publication Date:
December 06, 2006
Filing Date:
November 18, 1998
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B25J15/06; H05K13/04; (IPC1-7): B25J15/06; H05K13/04
Domestic Patent References:
| JP454689U | ||||
| JP56109892U | ||||
| JP10128634A | ||||
| JP9193069A | ||||
| JP57131288U |
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano
Previous Patent: CONVEYING MECHANISM OF AUTOMATIC WASHER
Next Patent: TRENCH SEPARATING METHOD FOR SEMICONDUCTOR INTEGRATED CIRCUIT
Next Patent: TRENCH SEPARATING METHOD FOR SEMICONDUCTOR INTEGRATED CIRCUIT