OPTICAL SEMICONDUCTOR SEALING RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR SEALED WITH CURED PRODUCT OF THE COMPOSITION

Title:

OPTICAL SEMICONDUCTOR SEALING RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR SEALED WITH CURED PRODUCT OF THE COMPOSITION

Document Type and Number:

Japanese Patent JP2011132384

Kind Code:

A

Abstract:

To provide an optical semiconductor sealing resin composition, which exhibits low viscosity, a long pot life after mixing two liquids, high light transmissivity after curing, excellent light resistance, and excellent resistance to heat discoloration; hardly causes a crack or separation from an element; and can maintain high luminance over the long-term use.

The optical semiconductor sealing resin composition comprises an epoxy resin (A); an acid anhydride (B); a boron-based curing catalyst (C); and a (meth)acrylic acid ester copolymer (D) having a hydroxy group.

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Inventors:

USAMI SUKEAKI
MIYAWAKI ATSUHISA
IKUSHIMA NAOYA
SHOJI TOSHIHIRO

Application Number:

JP2009293799A

Publication Date:

July 07, 2011

Filing Date:

December 25, 2009

Export Citation:

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Assignee:

DAINIPPON INK & CHEMICALS

International Classes:

C09K3/10; C09J11/06; C09J133/06; C09J133/14; C09J163/00; H01L23/29; H01L23/31; C08G59/62

Attorney, Agent or Firm:

Kono Tsuyo

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