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Patent Searching and Data


Title:
ORGANIC COMPOUND DECOMPOSITION TREATMENT APPARATUS
Document Type and Number:
Japanese Patent JP2003190770
Kind Code:
A
Abstract:

To seal the gap between a rotary kiln and a tubular body with gas in an organic compound decomposition treatment apparatus for supplying an organic compound component being matter to be treated to the rotary kiln for pyrolyzing the organic compound component through the tubular body inserted in the kiln coaxially.

A housing 10 is provided so as to airtightly cover the region ranging from the rotary kiln 1 to the tubular body 2 and the packing 11 provided on the side of the housing 10 is airtightly brought into slide contact with the slide body 20 mounted on the tubular body 2. By providing the packing 11 to the housing 10 being a separate body with respect to the high temperature rotary kiln 1, the packing 11 is not exposed to intense heat and the gap 8 between the rotary kiln 1 and the tubular body 2 is effectively sealed with gas by the packing 11.


Inventors:
KIDA KIYONORI
OKAYAMA SAKAE
TADANO HIDEAKI
MATSUSHITA MASANORI
Application Number:
JP2001397334A
Publication Date:
July 08, 2003
Filing Date:
December 27, 2001
Export Citation:
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Assignee:
FUJI ELECTRIC CO LTD
International Classes:
B01J19/00; C10B53/00; F27B7/24; F27D7/06; B09B3/00; (IPC1-7): B01J19/00; B09B3/00; C10B53/00; F27B7/24; F27D7/06
Attorney, Agent or Firm:
Iwao Yamaguchi (2 people outside)