Title:
ORGANIC ENCAPSULANT COMPOSITION FOR PROTECTING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2008004921
Kind Code:
A
Abstract:
To provide an organic encapsulant composition for protecting electronic components.
The organic encapsulant composition applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards allows the capacitor to resist printed wiring board chemicals, thereby passing an accelerated life testing conducted for 1,000 hours under high humidity, elevated temperature and applied DC bias.
Inventors:
DUEBER THOMAS E
SUMMERS JOHN D
BORLAND WILLIAM J
RENOVALES OLGA L
MAJUMDAR DIPTARKA
SUMMERS JOHN D
BORLAND WILLIAM J
RENOVALES OLGA L
MAJUMDAR DIPTARKA
Application Number:
JP2007100465A
Publication Date:
January 10, 2008
Filing Date:
April 06, 2007
Export Citation:
Assignee:
DU PONT
International Classes:
H01L23/29; C09K3/10; H01G4/12; H01L23/31; H05K3/46
Attorney, Agent or Firm:
Yoshikazu Tani
Kazuo Abe
Kazuo Abe