Title:
ORGANOMETALLIC ADDUCT COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME
Document Type and Number:
Japanese Patent JP2023043193
Kind Code:
A
Abstract:
To provide an organometallic adduct compound and a method of manufacturing an integrated circuit device by using the same.SOLUTION: The invention provides an organometallic adduct compound of the general formula in the figure. In the formula, R1, R2, R3, R4 and R5 are each independently a hydrogen atom, a halogen atom, a substituted or unsubstituted C1-C5 linear alkyl group, a substituted or unsubstituted C3-C5 branched alkyl group, a substituted or unsubstituted C2-C5 linear alkenyl group, or a substituted or unsubstituted C3-C5 branched alkenyl group; X is a halogen atom; and M is a niobium atom or a tantalum atom.SELECTED DRAWING: Figure 1
Inventors:
RYU SEUNG-MIN
KIM YOON-SOO
KIM JAEWOON
HARANO KAZUKI
SAITO KAZUYA
KOIDE YUKINOBU
AOKI YUTARO
PARK GYUHEE
CHO YOUN-JOUNG
FUSE WAKANA
MANABE YOSHIKI
UCHIOKURA HIROYUKI
KIMURA MASAYUKI
YOSHII TAKAHIRO
KIM YOON-SOO
KIM JAEWOON
HARANO KAZUKI
SAITO KAZUYA
KOIDE YUKINOBU
AOKI YUTARO
PARK GYUHEE
CHO YOUN-JOUNG
FUSE WAKANA
MANABE YOSHIKI
UCHIOKURA HIROYUKI
KIMURA MASAYUKI
YOSHII TAKAHIRO
Application Number:
JP2022147469A
Publication Date:
March 28, 2023
Filing Date:
September 15, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
ADEKA CORP
ADEKA CORP
International Classes:
C07F9/00; C07D213/16; C07D213/26; C07D213/61; C23C16/18; H01L21/285; H01L21/822
Attorney, Agent or Firm:
Tadashige Ito
Koichi Hirota
Tadahiko Ito
Koichi Hirota
Tadahiko Ito