ORGANOMETALLIC COMPOUND FOR FORMING METAL PATTERN AND METHOD FOR FORMING METAL PATTERN USING THE SAME

Title:

ORGANOMETALLIC COMPOUND FOR FORMING METAL PATTERN AND METHOD FOR FORMING METAL PATTERN USING THE SAME

Document Type and Number:

Japanese Patent JP2003183257

Kind Code:

A

Abstract:

To provide a new organometallic compound and a method for forming a metal pattern using the compound.

This organometallic compound for forming the metal pattern is represented by chemical formula (1) L'-M-L (1) (wherein, M is one kind of transition metal selected from the group consisting of Ag, Au, Cu, Pd, Ni and Pt: L is an imidazolylidene compound having a specific structure; and L' is an imidazolylidene compound having a specific structure or a β-diketonate having a specific structure). Since L', M and L are present on the nearly same plane, the compound is capable of reducing the bulkiness of an organic ligand which is the largest cause of metal film shrinkage. Furthermore, L' and L have characteristics of readily degrading and eliminating the ligand with light. Thereby, cracking can be suppressed when the metal pattern is formed.

Inventors:

JUNG MIN CHUL
HWANG SOON TAIK
BYUN YOUNG HUN
HWANG EUK CHE

Application Number:

JP2002265556A

Publication Date:

July 03, 2003

Filing Date:

September 11, 2002

Export Citation:

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Assignee:

SAMSUNG ELECTRONICS CO LTD

International Classes:

G03F7/004; C07C49/92; C07D233/04; C07F1/00; C07F1/08; C07F1/10; C07F15/00; C07F15/04; G03F7/00; H01L21/027; H01L21/288; H05K3/10; (IPC1-7): C07D233/04; C07C49/92; G03F7/004; H01L21/027; H01L21/288

Attorney, Agent or Firm:

Mikio Hatta (4 outside)

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