PACKAGE FOR OPTICAL TRANSMISSION MODULE

Japanese Patent JP3457958

B2

PROBLEM TO BE SOLVED: To provide a low-cost package for optical transmission module which has such a structure as easy placement of parts in a case, improved properties of heat radiation, favorable airtightness, and high mechanical reliability, and allows the height of packages to be lowered.
SOLUTION: The package for optical transmission module comprises a hermetic sealing case 1; an insulating layer 2 not more than 0.2 mm in thickness formed in at least part of the interior of the hermetic sealing case 1; lower wiring conductors 3a formed on the insulating layer 2; a plurality of thermoelectric transducers 5 which are arranged in a lattice pattern and joined with the upper faces of the lower wiring conductors 3a; upper wiring conductors 3b joined with the upper faces of the thermoelectric transducers 5; a ceramic board 6 which is placed on the upper wiring conductors 3b and is not less than 10 W/mK in thermal conductivity; and external incoming terminals 10 the one-side ends of which are connected with electrodes 4 formed on parts of the lower wiring conductors 3a, and the other-side ends of which penetrate the hermetic sealing case 1 and externally protrude therefrom.

Hirokazu Tanaka
Nishizono Kazuhiro
Masato Fukudome
Kenichi Tajima

JP2001294752A

October 20, 2003

September 26, 2001

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Kyocera Corporation

H01L23/38; H01L23/02; H01L23/04; H01L23/18; H01L31/02; H01L31/10; H01L35/08; H01L35/10; H01L35/16; H01L35/32; H01L35/34; (IPC1-7): H01L23/38; H01L23/02; H01L35/08; H01L35/10; H01L35/32; H01L35/34

JP2002280621A
JP2002314153A
JP200317761A

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