Title:
PACKAGE FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2014203889
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a package in which the strength of a suspension lead and the holding force of the package by the suspension lead are high, and to provide a semiconductor device using this package.SOLUTION: A package 2 has lead electrodes 10, 20, and a resin molding 3 for resin molding the lead electrodes 10, 20, in which the resin molding 3 is annular and a cap 3a for arranging a semiconductor element is provided on the inside of the resin molding 3. The package 2 is held by a lead frame 65 via a suspension lead 60. The pawl 61 of the suspension lead 60 is separated farther from the bottom surface of the package 2 toward the tip side. The pawl 61 is inserted into the resin molding 3.
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Inventors:
UMEDA KAZUNORI
MATSUI JUN
KATO YUKIO
MATSUI JUN
KATO YUKIO
Application Number:
JP2013076973A
Publication Date:
October 27, 2014
Filing Date:
April 02, 2013
Export Citation:
Assignee:
MITSUBISHI PLASTICS INC
International Classes:
H01L33/62; H01L23/02; H01L23/04; H01L23/48
Attorney, Agent or Firm:
Takeshi Shigeno