Title:
PACKAGE FOR SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP3411204
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent a stub circuit for a high frequency signal from being formed at the connecting part of a wiring conductor with a lead terminal mounting pad on the outer peripheral side face of an insulating substrate, and to efficiently input and output a high frequency signal.
SOLUTION: In a package for a semiconductor element, a recessed part 1a and a placing part 1b of a semiconductor element 5 are provided on the upper face of an insulating substrate 1, and a wiring conductor 2 derived from the surrounding part of the placing part 1b to the outer peripheral side face of the insulating substrate and a lead terminal mounting pad 3 adhered to the outer peripheral side face and connected with the derived terminal of the wiring conductor 2 are formed, and an outside lead terminal 4 is mounted, and a cover body 6 is mounted on the upper face of the surrounding part of the recessed part 1a. In this case, a recession 8 wider than that of the lead terminal mounting pad 3 is provided in an area just above the derived terminal of the wiring conductor 2 on the outer peripheral side face of the insulating substrate 1. Thus, any stub circuit can be prevented from being formed, and high frequency characteristics can be made satisfactory.
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Inventors:
Shigeo Morioka
Shinichi Nakatani
Shinichi Nakatani
Application Number:
JP972598A
Publication Date:
May 26, 2003
Filing Date:
January 21, 1998
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/02; H01L23/04; (IPC1-7): H01L23/04; H01L23/02
Domestic Patent References:
| JP766311A | ||||
| JP897320A | ||||
| JP54117683A | ||||
| JP6439644U |