To provide a package structure of an SAW(surface acoustic wave) device, wherein the bonding strength when a grounding electrode surface formed on the inner bottom of a ceramic package by a gold plating is bonded to the bottom of a surface acoustic wave element, which is housed in the package with a bonding agent, is significantly enhanced through only a simple adjusting work at gold plating, without causing reduction in the shielding efficiency of the structure, increase in the number of components, and increase in the size of the components.

This package structure, wherein in a piezoelectric device which is provided with a ceramic package, which has a recessed depressed part 3 on the upper surface thereof and at the same time, has a grounding electrode surface 13 on the bottom of the part 3, and a piezoelectric element which is adhesively fixed on the bottom of the part 3 with a bonding agent and is housed in the part 3, a ceramic surface 40, through which the inner bottom of the ceramic package is exposed, is provided on at least one part which is positioned on the side of the package of the grounding electrode surface, and at least one part of the bonding agent is bonded to the ceramic surface 40.