Title:
PACKAGING FILM
Document Type and Number:
Japanese Patent JP3442456
Kind Code:
B2
Abstract:
PURPOSE: To provide a packaging film having excellent pinhole resistance and preventing the deterioration of an article to be packaged by partially bonding a laminated film and an outer film and further partially applying a heat-fusible substance to either one of or both of the opposed surfaces of the laminated film and the outer film at desired positions.
CONSTITUTION: A heat-fusible substance 4 such as an ethylene/vinyl acetate copolymer, butyl rubber or chlorinated polypropylene is partially applied to a laminated film 2 and/or an outer film 3 at desired positions by heating or in a soln. form. Since the laminated film 2 and the outer film 3 can be heat- sealed at the positions coated with the heat-fusible substance 4, the heat-fusible substance 4 may be applied to parts where the films are desired to be mutually bonded by heat sealing at the time of bag making. Subsequently, the laminated film 2 and the outer film 3 are partially bonded through strip like adhesive layers 5 parallel to the longitudinal direction of both films containing at least bath side end parts thereof to obtain a packaging film.
Inventors:
Kazuo Uchiyama
Application Number:
JP4072794A
Publication Date:
September 02, 2003
Filing Date:
March 11, 1994
Export Citation:
Assignee:
Okura Industry Co., Ltd.
International Classes:
B65D65/40; B32B7/14; B32B15/08; B32B27/00; B32B27/08; (IPC1-7): B32B7/14; B32B27/00; B32B27/08; B65D65/40
Domestic Patent References:
| JP193337A | ||||
| JP61280921A | ||||
| JP60255428A | ||||
| JP5632053U | ||||
| JP5632052U |
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