Title:
PACKAGING METHOD
Document Type and Number:
Japanese Patent JPH0872930
Kind Code:
A
Abstract:
PURPOSE: To easily and assuredly unseal a package by a method wherein an article to be packaged is wrapped by an external packaging film, and specified overlapped surfaces are heat-bonded to seal the package.
CONSTITUTION: A totally non-adhered part 6 without adhering force is provided at one part of an overlapped surface (bonding surface) of an external packaging film 1, and the non-adhered part 6 is made an unsealing spot 5. At the time of unsealing, the tip (nail) of a finger is inserted in a gap of the unsealing spot 5, and the external packaging film 1 can be easily peeled.
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Inventors:
SEKI SEIZO
Application Number:
JP20361794A
Publication Date:
March 19, 1996
Filing Date:
August 29, 1994
Export Citation:
Assignee:
SONY CORP
International Classes:
B65D75/66; B65D65/14; B65D65/26; (IPC1-7): B65D75/66; B65D65/14; B65D65/26
Attorney, Agent or Firm:
Hidekuma Matsukuma
Next Patent: PACKAGE MADE OF PLASTIC FILM