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Patent Searching and Data


Title:
PACKAGING STRUCTURE OF SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JPH06168985
Kind Code:
A
Abstract:

PURPOSE: To partially reinforce a film carrier having flexibility by building a layer of a reinforcing material to arrest flexibility around the resin cladding and on the cladding itself of the film carrier which comprises two or three highly flexible layers.

CONSTITUTION: An opening 4a is formed in a preset part of a flexible film 4, upon which a group of lead wires 3a are formed with a conductor wiring 3 and part of it extending to the opening 4a, thereby forming a two-layer film carrier 9. Here, the size of the opening 4a is formed slightly larger than that of a semiconductor element 1 and, onto the opposite side of the surface on which this semiconductor 1 is mounted, a reinforcing material 6 having an opening 6a which is larger than that opening is glued with an adhesive 7 and fixed. As a result, high dimensional stability and improved flatness are obtained at the reinforced part.


Inventors:
ISHII TOSHIAKI
Application Number:
JP32010292A
Publication Date:
June 14, 1994
Filing Date:
November 30, 1992
Export Citation:
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Assignee:
SHARP KK
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Umeda Masaru