Title:
PACKAGING STRUCTURE
Document Type and Number:
Japanese Patent JP2023160859
Kind Code:
A
Abstract:
To obtain a packaging structure that can suppress the occurrence of electromagnetic field coupling in a closed loop inside a module casing while suppressing an increase in the number of components.SOLUTION: A packaging structure includes a substrate 6 having recesses 6d, 6d, a first transmission system MMIC amplifier 2 mounted in one recess 6d, a second transmission system MMIC amplifier 3 mounted in the other recess 6d, a transmitting/receiving circuit, a module housing 1 made of metal or whose surface is covered with metal and housing the substrate 6 therein, and a plate portion 16 made of metal or whose surface is covered with metal, which is a plate that covers the first transmission system MMIC amplifier 2 and the second transmission system MMIC amplifier 3.SELECTED DRAWING: Figure 5
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Inventors:
MIZUTANI TOMOHIRO
Application Number:
JP2023138762A
Publication Date:
November 02, 2023
Filing Date:
August 29, 2023
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H04B1/38; H03F3/24
Attorney, Agent or Firm:
Jun Takamura