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Patent Searching and Data


Title:
PACKING FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH10287324
Kind Code:
A
Abstract:

To improve resistance against impact of packing and also to enable a spacer to be reused as a resource by interposing the spacer made of corrugated fiberboard in a slit between a reel received in a corrugated fiberboard box and a corner of the corrugated fiberboard box in parallel to an axis of the reel.

When a plurality of reels 12 comprising a plastic tape for receiving numerous electronic components contiguously wherein the tape is rolled in a corrugated fiberboard box 10 are to be stored while being coaxially stacked, a spacer 14 is inserted into a slit between a corner of the box 10 and the reel 12 in parallel to an axis of the reel 12. The spacer 14 is made of corrugated fiberboard and is formed of a protrusion 16 having an approximately chevron-shaped cross section, a pair of flat parts 18, 18 extending to both sides from a lower rim of the protrusion 16 and a flat bottom 20 overlying on the pair of flat parts 18, 18. A tip of the protrusion 16 is positioned at the corner of the corrugated fiberboard box 10, and the flat bottom 20 is brought into contact with a side of the reel 12, thereby holding the reel 12 in a cushioned and immovable state.


Inventors:
TSUNEMI MASAYOSHI
KUROIWA KATSUTOSHI
SHOJI NAOKI
Application Number:
JP11026397A
Publication Date:
October 27, 1998
Filing Date:
April 11, 1997
Export Citation:
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Assignee:
TAIYO YUDEN KK
International Classes:
B65D5/50; B65D5/44; B65D59/00; B65D85/86; (IPC1-7): B65D5/50; B65D59/00
Attorney, Agent or Firm:
Kubota Noriaki