Title:
PALLET DEVICE FOR SOLDERING
Document Type and Number:
Japanese Patent JP2005072441
Kind Code:
A
Abstract:
To provide an inexpensive pallet device for soldering capable of carrying out the attachment / detachment of a retaining tool by simple work in a short time.
The pallet device 1 for soldering a plurality of lead components 3 to a printed circuit board 2 is provided with a plurality of arm members 6 for pressing the plurality of lead components 3 to the printed circuit board 2, and a support member 7 bridged over the printed circuit board 2 and for supporting the plurality of arm embers 6.
Inventors:
SATO TERUTSUGU
Application Number:
JP2003302652A
Publication Date:
March 17, 2005
Filing Date:
August 27, 2003
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
B23K3/00; H05K3/34; B23K101/42; (IPC1-7): H05K3/34; B23K3/00
Attorney, Agent or Firm:
Nobuo Kinutani