Title:
PARTIAL PLATING METHOD OF LONGGLENGTH STRIP
Document Type and Number:
Japanese Patent JPS5511101
Kind Code:
A
Abstract:
PURPOSE:To economically electroplate only on the required portions of long-length strip by providing a plating solution supply pipe which has multiple injection nozzles in its lengthwise direction and has an anode in the inside within a plating bath. CONSTITUTION:The long-length strip 1 to be plated travels horizontally and has been affixed with a masking tape 2 over the entire part by leaving the necessary portions to be plated. Plating solution is locally blown to from the injection nozzles 8 of a supply pipe 4 to the portions not affixed with the masking tape 2. At this time a bar-form anode 6 is provided in the plating solution supply pipe 4 and in the association of this to the power feed roll 9 connected to a cathode terminal 10, electroplating is adequately accomplished. This method enables partial plating to be accomplished extremely economically as compared to conventional full surface hot dipping in costly noble metal plating.
Inventors:
YAMAGISHI RIYOUZOU
SUGIYAMA MITSUHIKO
WATANABE MASARU
ONDA MAMORU
SUGIYAMA MITSUHIKO
WATANABE MASARU
ONDA MAMORU
Application Number:
JP5737078A
Publication Date:
January 25, 1980
Filing Date:
May 15, 1978
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
C25D5/02; C25D5/08; C25D17/00; (IPC1-7): C25D5/02; C25D5/08; C25D17/00
Domestic Patent References:
| JPS483617U | 1973-01-17 | |||
| JPS49112571A | 1974-10-26 |