Title:
PARTIAL PLATING METHOD
Document Type and Number:
Japanese Patent JPS58167794
Kind Code:
A
Abstract:
PURPOSE:To apply partial plating to an object with a complicated shape certainly, economically and efficiently, by a method wherein an object to be plated of which the plating surface is masked with non-conductive heat resistant rubber is coated over the entire surface thereof and, after drying, rubber masking is removed to carry out plating. CONSTITUTION:For example, non-conductive masking rubber 7 having heat resistance is fixed to the large end surface 2 of a connecting rod 1. In this state, a non-conductive coating is applied to the entire surface of the rod 1 by dipping by using a coating material 8. In this case, electrodeposition coating may be applied. In the next step, and rubber 7 is removed to obtain the connecting rod 11 having no non-conductive coating on the large end surface thereof. After this rod 11 is subjected to degreasing treatment, plating is applied in the order of silver plating and solder plating as carried out conventionally. By this process, the connecting rod 12 having plating 21 only on the large end surface 2 thereof is obtained. Subsequently, according to necessity, a coating releasing agent 9 such as a caustic soda solution is used to remove the residual coating.
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Inventors:
HAYASHIDA TSUTOMU
IMAMURA TAKASHI
IMAMURA TAKASHI
Application Number:
JP5163382A
Publication Date:
October 04, 1983
Filing Date:
March 30, 1982
Export Citation:
Assignee:
SUZUKI MOTOR CO
International Classes:
C25D5/02; (IPC1-7): C25D5/02
Domestic Patent References:
| JPS4946379A | 1974-05-02 |
Attorney, Agent or Firm:
Okuyama Nao
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