Title:
ペースト状樹脂組成物
Document Type and Number:
Japanese Patent JP7056649
Kind Code:
B2
Abstract:
A paste-like resin composition which contains (A) an epoxy resin, (B) a liquid curing agent, (C) a heat conductive filler and (D) a dispersant.
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Inventors:
Black Lord Shoji
Keishi Ogino
Keishi Ogino
Application Number:
JP2019510138A
Publication Date:
April 19, 2022
Filing Date:
March 29, 2018
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; C08G59/66; C08K3/22; C08K3/28; C08K3/34
Domestic Patent References:
| JP2013133454A | ||||
| JP201741633A |
Foreign References:
| WO2016088832A1 |
Attorney, Agent or Firm:
Sakai International Patent Office