PURPOSE: To avoid sticking adhesives to the rear surface of a semiconductor pellet by making, in a pasting sheet, at least one small hole in a position corre sponding to each semiconductor pellet on a wafer.

CONSTITUTION: Before a wafer 1 is pasted on a pasting sheet 2, a small hole 4 is made in each part corresponding to an individual semiconductor pellet 1a, Then, in a state that the wafer 1 has been pasted to an adhesive 3 on the pasting sheet 2, the wafer 1 is broken into each semiconductor pellet 1a; after that, the pasting sheet 2 is stretched in two directions which are perpendicular to each other. When each semiconductor pellet 1a is to be picked up, the semi conductor pellet 1a is pushed up toward a suction collet 6 arranged on the surface top side by using a needle-shaped body 5 arranged on the rear surface of the pasting sheet 2; during this process, the tip part of the needle-shaped body 5 is pierced through the small hole 4 which has been made in the pasting sheet 2, is brought into contact with the rear surface of the semiconductor pellet 1a and pushes up the pellet; accordingly, it is possible to avoid surely sticking one part of the adhesive 3 on the side of the pasting sheet 2 to the semiconductor pellet 1a.